BANNOCKBURN, IL—A new IPC study says congressional action is urgently needed to strengthen the health of the domestic advanced packaging industry if it is to meet increased demand in chip production.

SEOUL—SKC says it will build a 12,000 square-meter plant in Georgia by 2023 to produce a proprietary computing glass substrate for semiconductors. The material will significantly increase the performance and power efficiency of computer chipsets.

BOUSKOURA, Morocco—The global semiconductor company STMicroelectronics says it hopes to procure half of the energy needed for its plant here through wind power by 2022, compared to only 1 percent currently.

BANNOCKBURN, IL—The trade association IPC has launched its newest workforce development training course, "Electronics Assembly for Engineers.” Students earn an IPC Certificate of Completion after finishing the 24 hours of course content.

NEWMAN LAKE, WA—Hentec Industries/RPS Automation, a manufacturer of selective soldering and test equipment for electronics, has expanded its assembly and production workforce, and published an 8-page technical paper entitled “Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components.”

NEW YORK—A recently released report, "Global Electrically Conductive Adhesives Industry," projects the global market for electrically conductive adhesives to grow at a compound annual rate of 7.3 percent over the next six years and reach $4 billion by 2027.