Two of the newest soldering tools will be on display at this year’s ASSEMBLY Show.

Adhesive suppliers tackle a range of new bonding applications.

Multimedia Editor and Host Jennifer Pierce shares highlights from ASSEMBLY Audible's September podcasts.

MONTGOMERY, AL—First Solar Inc. has opened its new $1.1 billion, vertically integrated thin-film solar panel assembly plant here. 

OULU, Finland—JOT Automation Inc. and EID Robotics have introduced a system of standardized, modular, robotic cells that can be combined to create microfactories for localized automated manufacturing of products.

An innovative 3D printing method streamlines multimaterial manufacturing.

AUBURN, MA—PI’s new N-332 nanometer-precision linear stage family is designed for high-end applications in semiconductors, fiber-optics, microscopy, nanobiotechnology, metrology, and research on beamlines and lasers. 

EC-1015HP epoxy potting compound provides significantly better crack resistance than traditional rigid epoxies.

DELO Dualbond EG6290 is a new sealant for CMOS image sensors, which are often used in driver monitoring systems.

Henkel has introduced three new potting compounds to protect automotive components from moisture and fluid ingress.