Electronics Assembly

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HORSHAM, PA—Aegis Software, a global provider of manufacturing execution software, has signed an enterprise agreement with L3Harris Technologies to support 20 manufacturing sites and more than 5,500 end users with Aegis’ FactoryLogix platform.

TAYLOR, TX—Samsung will spend $17 billion over the next three years to build a semiconductor fab here in an effort to expand its manufacturing capacity in the U.S. at a time of a global shortage of chips.

ROSSLYN, VA—The National Electrical Manufacturers Association recently recommended to the Commerce Department Bureau of Industry and Security the need to establish U.S. semiconductor manufacturing and supply chain capabilities in key applications, such as those that use connectivity technologies.

BANNOCKBURN, IL—A new IPC study says congressional action is urgently needed to strengthen the health of the domestic advanced packaging industry if it is to meet increased demand in chip production.

SEOUL—SKC says it will build a 12,000 square-meter plant in Georgia by 2023 to produce a proprietary computing glass substrate for semiconductors. The material will significantly increase the performance and power efficiency of computer chipsets.

BOUSKOURA, Morocco—The global semiconductor company STMicroelectronics says it hopes to procure half of the energy needed for its plant here through wind power by 2022, compared to only 1 percent currently.