UC-2210M is a urethane formulated to protect electronic components in high moisture and thermal environments, including constant atmospheric exposure, oceanographic environments and high humidity conditions.

This room-temperature curing material is easy to apply as a potting, encapsulation or casting compound. Its low viscosity allows for easy air removal, as well as penetration of intricate encapsulated areas.

UC-2210M cures to a semi-rigid polymer that minimizes stresses on delicate components. It has good thermally conductivity, protecting electronics from heat stresses. It offers exceptional thermal shock production, from -55 to 130 C. It also provides high impact resistance.

See this company at The ASSEMBLY Show, Oct. 22-24, in Rosemont, IL.

EpoxySet Inc.
epoxysetinc.com