VISTA, CA--Palomar Technologies, a manufacturer of automated wire and die bonding systems for broadband communications, won the 2001 Advanced Packaging Award for its laser diode attach automated assembly cell. The award was presented at SEMICON West 2001 in San Jose, CA. Palomar's entry won the award for the most innovative product in the category of die placement and attach, including the handling, alignment and attachment of a chip to a substrate.

Ten judges from major universities, consortia and consultancies selected the winners. Each entry was evaluated in innovation, cost effectiveness, speed and throughput, quality, ease of use, maintainability and environmental responsibility.